Shenzhen Wisdomshow Technology Co.,ltd

Shenzhen Wisdomshow Technology Co.,ltd

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Vacuum Pump BGA Reballing Equipment 7600W For 0.3*0.6mm 90*90mm BGA Chip

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Shenzhen Wisdomshow Technology Co.,ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MrJack Du
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Vacuum Pump BGA Reballing Equipment 7600W For 0.3*0.6mm 90*90mm BGA Chip

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Place of Origin :Guangdong, China
Brand Name :WISDOMSHOW
Certification :CE
Packaging Details :Bga Rework Station
wds800A is packed by Wooden Box
Price :$20,160.00/Sets
Condition :New
Machine Type :Welding Positioner
Applicable Industries :Machinery Repair Shops, Manufacturing Plant, Retail, Construction works , Energy & Mining
Showroom Location :None
Video outgoing-inspection :Provided
Machinery Test Report :Provided
Marketing Type :Ordinary Product
Warranty of core components :1 Year
Core Components :Motor
Warranty :1 Year
Key Selling Points :Automatic
Weight (KG) :180
Voltage :220/110V
Current :50/60hz
Rated Capacity :N
Rated Duty Cycle :N
Dimensions :L780*W980*H950mm
Usage :mobile phone/laptop BGA/IC rework and repair
Function :Repair chips
Electrical Material :High sensitive touch screen IPC+temp. control module+PLC+step driver
Total Power :7600W
PCB size :Max610*500mm Min 10*10 mm
BGA Chip Size :Max90*90mm Min 0.3*0.6mm
Power :Ac220v ±10%,50/60hz
Heater power :Upper temp.one 1200w,second temp.zone1200w,IR temp.zone 5000w
Alignment system :Optical prism + HD camera
Thermocouple port :5pcs
Weight :140KG
After-sales Service Provided :Video technical support, Online support
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WDS-800A IR heating automatic IC replacement bga welding equipment for iphone playstation 4/3 xbox console
Product Description
Vacuum Pump BGA Reballing Equipment 7600W For 0.3*0.6mm 90*90mm BGA Chip
Our BGA Rework Station/ BGA reballing station are widely used to replace and repair the BGA chip in laptop, mobile phone,xbox360,ps3,etc.
The main user is repairing shops and factory to provide the after-sales service and rework.

How to separate BGA chip from motherboard?
How to replace a new BGA chip?

Repair steps:
1) Separate the BGA chip from motherboard –we called desoldering
2) Clean Pad
3) Reballing or replace a new BGA chip directly
4) Alignment/Positioning – Depend on experience ,silk frame ,optical camera
5) replace a new BGA chip - we called Soldering
Product Paramenters
Power supply
AC 220V±10% 50/60Hz
Total power
7600W
Heater power
Upper temp.zone 1200W,second temp.zone 1200W,IR temp.zone 5000W
Electrical material
High sensitive touch screen+temperature control module+PLC+step driver
Temperature controlling
High precision K shape sensor(Closed Loop),up and down independent temperature heating zone,Precision can reach±2℃
Locating way
V shape holder&universal jigs
PCB size
Max610×500mm Min 10×10 mm
Applicable chips
Max90×90mm Min 0.3×0.6mm
PCB thickness
0.5-8mm
Mounting precision

±0.01mm

Overall dimension
L780*W980*H950mm(without frame)
Thermo-couple Ports
5 pcs
Weight of machine
140KG

Alignment system

Optical lens+HD industrial camera

Main Features

1. Hot air head and mounting head integration design, with auto soldering and desoldering functions.

2. Independent 3 heaters, upper and lower heaters can realize move synchronously and automatically,can reach IR every position.Lower heater zone can remove up and down,support PCB board. bottom pre-heating area along X/Y axis. Lower heater can move up/down and support PCB,auto-controlled by motors. It can realize the upper and lower heater able to move towards target BGA, without moving PCB.

3. PCB board adopts high accuracy slider to make sure the mount precision of BGA and PCB.

4. Unique bottom preheating table made of Germany-imported good quality heating materials plated IR tube & constant temperature glass anti-dazzle (heat-resist up to 1800 C), pre-heating area up to 500*420mm.

5. Preheating table, clamping device and cooling system can move integrally in X axis that make PCB locating & desoldering safer and conveniently.

6. X and Y axis adopt motor automatic control moving way to make the alignment faster and more convenient,make the most use of the equipment space,realization of repairing large area PCB with a smaller volume of equipment.The Max.plate size can reach 650*610mm,no repair dead corner.

7. Double rocker control the camera and upper and lower heating platform to make sure the alignment precision accuracy.

8. Inbuilt vacuum pump, rotate 360 in angel; fine-adjusting mounting suction nozzle.

9. Suction nozzle can detect BGA pickup and mounting height automatically with pressure controllable within 10 grams; zero pressure available to smaller BGA pickup and mounting.

10. With 10 segments of temperature up (down) and 10 segments of constant temperature control,can save many segments of temperature.analyze the temperature parameter curves on the touch screen.

11. Many sizes of alloy nozzle, easy for replacement; can locate at all angle.

12. With 5 thermocouple ports, can real-time detect and analyze temperatures at multipoint.

13. With a solid operation display function to make the temperature control more reliable.

14. It can generate SMT standard temperature removing curve automatically in different regions and different environment temperature,don’t need to set curves manually, anybody can use it even without experience, realize machine intelligence.

15. With the camera that can observe the melting point of solder side, it is convenient to determine the curve (this feature is optional items).

Detailed Images
Vacuum Pump BGA Reballing Equipment 7600W For 0.3*0.6mm 90*90mm BGA Chip
Vacuum Pump BGA Reballing Equipment 7600W For 0.3*0.6mm 90*90mm BGA Chip
Vacuum Pump BGA Reballing Equipment 7600W For 0.3*0.6mm 90*90mm BGA Chip
Vacuum Pump BGA Reballing Equipment 7600W For 0.3*0.6mm 90*90mm BGA Chip
Vacuum Pump BGA Reballing Equipment 7600W For 0.3*0.6mm 90*90mm BGA Chip
Packing&Shipping
1, Standard Export Wooden cases
2, Delivery in 2 workdays after payment confirm;
3, Shipping by TNT,DHL,FEDEX , or by air or by sea
4, Loading port: Shenzhen or Hongkong.
Vacuum Pump BGA Reballing Equipment 7600W For 0.3*0.6mm 90*90mm BGA Chip
Company Introduction
Shenzhen Wisdomshow Technology Co., LTD.
Professional BGA Rework Station Manufacturer
1. Following the business philosophy of "professional, integrity, excellence, customer first";
2. One of the leading manufacturers of BGA rework stations;
3. Over 10 years' experience in the BGA rework industry;
4. All models have passed the CE Certificate and ISO;
5. 100% QC inspection before shipment;
6. Customized brand logo is acceptable;
7. Owning a large market share in the world;
Vacuum Pump BGA Reballing Equipment 7600W For 0.3*0.6mm 90*90mm BGA Chip
Vacuum Pump BGA Reballing Equipment 7600W For 0.3*0.6mm 90*90mm BGA Chip
Vacuum Pump BGA Reballing Equipment 7600W For 0.3*0.6mm 90*90mm BGA Chip
Vacuum Pump BGA Reballing Equipment 7600W For 0.3*0.6mm 90*90mm BGA Chip

Our Services & Advantages

contact:24 hours technical support by email or calling;
Warranty:one year free,but all the other relative cost should be on the buyer's account;
Technology Support : Provide Demo operation video for training ;If you have time,welcome to our company,we will arrange engineers to show you the operation;
Service:Friendly English User manual provided; Good and professional after-sales service;
price:Give great discount to AGENCY to ensure agents profit.

Buyer Feedback

Our Customers' Voice:
1.Hi mate, your best price and high purity product is so competitive in my country , this let me make much profit , my customers are really like it . cooperate with you is so wonderful ! thank you ! ---------Richard---Turkey

2.i have received my products , your packing is do discreet and perfect , it really amazed me .i will order more from you as soon as possible. thanks a lot. -----------Robet--Australia

3.i have cooperated with you for many times , your product quality is so great , that is why i still buy the products from you
.thank you . ------------- Corentin ---Brazil
Vacuum Pump BGA Reballing Equipment 7600W For 0.3*0.6mm 90*90mm BGA Chip
Vacuum Pump BGA Reballing Equipment 7600W For 0.3*0.6mm 90*90mm BGA Chip
Vacuum Pump BGA Reballing Equipment 7600W For 0.3*0.6mm 90*90mm BGA Chip

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If any questions please send INQUIRY or CHAT with us ,
We will be glad to service you !
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Plz Contact me as below guide, we are glad to give you the best price!
Vacuum Pump BGA Reballing Equipment 7600W For 0.3*0.6mm 90*90mm BGA Chip
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