1.The upper and lower hot air heating,which can heat up at the same time from the top of the component to the bottom of the PCB; bottom IR heating, temperature precision control within ±1℃.8 segment temperature control independently.
2.Hot air district heating for BGA and PCB at the same time,and large area IR heater preheating up for the bottom of PCB to avoid completely PCB deformation during reworking,the upper or lower temperature zones could be used alone and combine freely the energy of up and lower heating element.
3.Adopted high precision K-type thermocouple close-loop control and PID parameter self-setting system; 4 temperature curves can be displayed with instant curve analysis function and multi-group user data can be saved;temperature can be tested precisely through external measurement interface,curves can be analysed,set and correct on the touch screen at any time.